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Dedicated polishing machine×えのきだ - List of Manufacturers, Suppliers, Companies and Products

Dedicated polishing machine Product List

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Fully Automatic Dual-Axis Dedicated Grinding Machine 'EAHW-083II'

Fully Automatic Dual-Axis Dedicated Grinding Machine 'EAHW-083II'

Achieving stable operability and outstanding durability! A high-precision, high-efficiency speed machine.

The 『EAHW-083II』 is a fully automatic dual-axis grinding machine that achieves stable operability and outstanding durability through its unique cam mechanism. The adoption of a grinding position stop mechanism makes it easy to set the grinding amount. It also accommodates assembled blades thanks to the flat blade skipping mechanism. Please feel free to contact us when you need assistance. 【Features】 ■ Doubles the workload with simultaneous grinding of right and left blades ■ No damage to the grinding wheel thanks to the forward feeding mechanism ■ Easy grinding amount setting with the adoption of the grinding wheel position stop mechanism ■ Stepless speed adjustment with a cam mechanism ■ Optional supply device can also be selected * For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully automatic dedicated two-axis polishing machine 'EGTW-081II'

Fully automatic dedicated two-axis polishing machine 'EGTW-081II'

The grinding speed is steplessly variable with a cam mechanism! Depending on the options, it is possible to choose the supply device.

The 『EGTW-081II』 is a fully automatic dual-axis grinding machine designed for simultaneous grinding of right and left blades, effectively doubling the workload. With the adoption of a grinding position stop mechanism, setting the grinding amount is easy. It accommodates assembled blades thanks to the flat blade skipping mechanism. Additionally, the supply device can be selected as an option. 【Target Workpieces】 ■ Saw diameter: φ160 to φ405 (other saw diameters can be accommodated with special specifications) ■ Grinding wheel: φ125-5W-5X-20T-32H × 2 pieces ■ Grinding wheel angle: 0° to +45° *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Squeegee Dedicated Polishing Machine 'EAH-086M'

Fully Automatic Squeegee Dedicated Polishing Machine 'EAH-086M'

Further approach to the diversifying blade shapes. Achieving various needs with labor-saving, cost-effectiveness, high precision, and high efficiency.

The "EAH-086M" is a fully automatic grinding machine specifically designed for squaring, achieving stable operability and outstanding durability. The cam drive allows for stepless speed variation with just one knob, making it easy to adjust the grinding time. The grinding wheel automatically reverses according to the blade type, preventing chipping and vibration. Additionally, the feed speed mechanism enables skipping pockets. It can also accommodate saw blades with chipped teeth. 【Features】 ■ The thickness of the saw blade is controlled by the handle, with digital display. ■ The flat teeth of the assembled blade can also be automatically ground, allowing for a complete finish in one pass. ■ Excellent surface accuracy reduces the friction of the diamond wheel. ■ The grinding wheel angle setting can be easily adjusted with a one-touch key operation from the panel. ■ Rich in operability and workability. *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Fully Automatic Specialized Grinding Machine 'EGT-078IIM'

Fully Automatic Specialized Grinding Machine 'EGT-078IIM'

Any blade type is fine with button operation! The height difference of flat blades is easy with just one dial.

The "EGT-078IIM" is a fully automatic dedicated grinding machine that allows for stepless speed adjustment with just one knob, making it easy to adjust grinding time. Digital adjustment of plate thickness is also a breeze. Grinding of blade shapes is done with automatic reversal, eliminating chipping and vibration. Please feel free to contact us when you need assistance. 【Features】 ■ Stable operability and excellent durability achieved through the use of a cam mechanism ■ Various blade shapes can be adjusted with just the push of a button ■ The grinding wheel angle can be easily adjusted with a handle ■ Two types of settings: one-pass and oscillation * For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully automatic side two-axis dedicated polishing machine 'EFII・III'

Fully automatic side two-axis dedicated polishing machine 'EFII・III'

Simultaneous grinding on both sides doubles the working power! The adoption of a grinding position stop mechanism allows for the setting of grinding volume.

The "EFII・III" is a fully automatic dual-axis grinding machine designed for side grinding, achieving excellent surface accuracy through its oscillation mechanism. The contact between the chip and the grinding wheel is smooth due to the cam mechanism, resulting in longer-lasting grinding wheels. The grinding speed can be infinitely variable. Please feel free to contact us when you need assistance. 【Features】 ■ Doubles the workload by grinding right and left blades simultaneously ■ Grinding speed is infinitely variable ■ High precision is achieved with the zero grinding stop mechanism (with timer adjustment) ■ Grinding amount can be set with the grinding position stop mechanism ■ The smooth contact between the chip and the grinding wheel due to the cam mechanism extends the life of the grinding wheel ■ The EF-III type can perform finishing grinding on flat blades in one cycle * For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Manual Side-Specific Polisher "EF-060"

Manual Side-Specific Polisher "EF-060"

A basic model of a side grinding machine that achieves high efficiency with high precision and high-level operability!

The "EF-060" is a manual side-specific grinding machine that achieves high efficiency with high precision and high-level operability. It features a compact design that does not take up much space. The oscillation mechanism allows for smooth contact between the grinding wheel and the chip. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compact design that does not take up much space ■ Smooth contact between the grinding wheel and the chip due to the oscillation mechanism *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Hole Saw Tip Dedicated Grinder 'EGTH-07'

Fully Automatic Hole Saw Tip Dedicated Grinder 'EGTH-07'

Easy workpiece attachment and detachment due to the Collet Chuck type! Air chuck is also available as an option.

The 『EGTH-07』 is a fully automatic sharpening machine specifically designed for the tips of hole saws, allowing for combinations of inner and outer blades as well as flat blades. It can be easily set up to identify the chips to be sharpened. Wet grinding is performed using an oscillating outer peripheral grinding stone (80φ). Please feel free to contact us when needed. 【Features】 ■ Allows for combinations of inner and outer blades, as well as flat blades (blade pattern writing method) ■ Easy workpiece attachment and detachment due to the collet chuck type (air chuck option available) ■ Easy setup to identify the chips to be sharpened ■ Wet grinding using oscillation with an outer peripheral grinding stone (φ80) *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Side Rough Grinding Machine 'EMS-080II'

Fully Automatic Side Rough Grinding Machine 'EMS-080II'

From small saws to large saws, we offer a wide range of options! Achieve high precision and efficiency with high rigidity and excellent operability.

The "EMS-080II" is a fully automatic side rough grinding machine that achieves high rigidity and excellent operability. The use of an air-oil conversion device allows for micro-cutting. Additionally, it is equipped with an intermediate stop function (with timer adjustment), ensuring stable precision. 【Features】 ■ Wide compatibility from small diameter saws to large diameter saws ■ Easy one-touch attachment and detachment of saws ■ Easy time adjustment with full stroke timer settings *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Side Dedicated Polishing Machine 'EF-92'

Fully Automatic Side Dedicated Polishing Machine 'EF-92'

Options include pocket skipping mechanism, notch correction, and flat blade correction!

The "EF-92" is a fully automatic side-specific grinding machine that offers high rigidity and stable precision. The oscillation mechanism provides excellent surface accuracy. With the adoption of the grinding position stop mechanism, setting the grinding amount is easy. Please feel free to contact us when you need assistance. 【Target Workpieces】 ■ Saw diameter: φ160 to φ380 ■ Diamond wheel: φ100-3X-6T-32H × 2 pieces ■ Squaring angle: MAX 30° ■ Grinding wheel: Diamond wheel φ125-6t-32H *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Hole Saw Outer Periphery Grinding Machine 'EOGH-1'

Fully Automatic Hole Saw Outer Periphery Grinding Machine 'EOGH-1'

Due to the wet oscillation type, the polishing surface is exceptionally excellent!

The "EOGH-1" is a fully automatic grinding machine specifically designed for the outer circumference of hole saws, featuring an air chuck system that allows for easy workpiece loading and unloading with the push of a button. With just one button, it can be easily set using a center clamp. Once the relief angles of the tips are set at one end, adjustments can be easily made even if the workpiece diameter changes. 【Target Workpieces (partial)】 ■ Workpiece diameter: φ16 to φ120 (other diameters available with special specifications) ■ Relief angle: 0° to +3° (long types available with special specifications) ■ Workpiece boss length: 38 to 45mm (long types and 65mm available with special specifications) ■ Cutting depth: up to 2mm *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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